Product Information
The Summit X670 model provides up to 48 ports in one system and up to 352 ports in a stacked system using SummitStack-V longer distance stacking technology.
With its versatile design, the Summit X670 series provides high density Layer 2/3 switching with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast routing to enable enterprise aggregation and core backbone deployment in AC-powered and DC-powered environments.
Summit X670 series simplifies network operation with the ExtremeXOS modular operating system (OS), which is used amongst all Extreme Networks Summit and BlackDiamond Ethernet switches. The high availability ExtremeXOS operating system provides simplicity and ease of operation through the use of one OS everywhere in the network.
- 10 Gigabit Ethernet switching
The Summit X670 model offers 48-port 10 Gigabit Ethernet non-blocking switching with 10GBASE-X SFP+ interfaces. Summit X670 is capable of Layer 2 and Layer 3 forwarding at up to 714 million packets per second forwarding rate in a small 1RU form factor, enabling next-generation high-performance server deployment in data centers. Both models support SummitStack-V high-speed, longer distance stacking. - SummitStack-V - flexible stacking over 10 Gigabit Ethernet
SummitStack-V capability utilizes 10 GbE ports as stacking ports, enabling the use of standard cabling and optics technologies used for 10 GbE such as XFP, SFP+, 10GBASE-T and XENPAK. SummitStack-V provides long-distance stacking connectivity of up to 40 km while reducing the cable complexity of implementing a stacking solution. - Low latency switching for high frequency trading and cluster computing
Summit X670 provides sub-microsecond latency and supports cut-through switching to help optimize the high frequency trading application as well as latency sensitive cluster computing. - Green design
The Summit X670 series is designed to be environmentally green. System power consumption is very low at both high-load and idle situations through the power-efficient hardware design. The power supplies are also highly efficient, which minimizes the loss of power and unnecessary heat generated by the power supply. Summit X670 series switches can be used in AC or DC powered environments. - Supports virtualized data centers
With the optional feature pack, Summit X670 switches can also support Direct Attach (VEPA), which eliminates the virtual switch layer, simplifying the network and improving performance. Direct Attach enables data center simplification by reducing network tiers from 4 or 5 tiers to just 3 or 2 tiers, depending on the size of the data center. - DCB support with enterprise core class scalability
The Summit X670 series supports Data Center Bridging features such as Priority Flow Control (PFC), Enhanced Transmission Selection (ETS) and Data Center Bridging eXchange (DCBX) for data center convergence. At the same time, the Summit X670 series offers more cost-effective 10 Gigabit Ethernet switches, for both small-sized core backbone and traditional three-tier network architectures. Summit X670 series can support 10 Gigabit Ethernet campus aggregation with its core class routing and switching scalability. The Summit X670 series can support up to 16,000 IPv6 longest prefix matching routing tables, 6,000 IP ARP entries and 3,000 IP multicast group entries. - 10 Gigabit Ethernet SFP+
The switches also support fiber-optical cable installation with SFP+ transceivers such as 10GBASE-SR, LR, LRM, and ER. Summit X670 SFP+ ports support dual interface speeds of Gigabit Ethernet and 10 GbE. SFP+ ports can accept both gigabit SFP and 10 gigabit SFP, and depending upon the pluggable optics you choose, SFP+ can work in both modes.